Tungsten Through Silicon Vias for 3D high quality factor embedded RF MEMS inductors
2013
Details
Title
Tungsten Through Silicon Vias for 3D high quality factor embedded RF MEMS inductors
Author(s)
Vitale, Wolfgang Amadeus ; Fernández-Bolaños Badía, Montserrat ; Wieland, Robert ; Weber, Josef ; Klumpp, Armin ; Ramm, Peter ; Ionescu, Adrian Mihai
Conference
39th International Conference on Micro and Nano Engineering, London, UK, September 16-19, 2013
Date
2013
Laboratories
NANOLAB
Record Appears in
Scientific production and competences > STI - School of Engineering > IEM - Institut d'Electricité et de Microtechnique > NANOLAB - Nanoelectronic Devices Laboratory
Peer-reviewed publications
Conference Papers
Work produced at EPFL
Published
Peer-reviewed publications
Conference Papers
Work produced at EPFL
Published
Record creation date
2013-11-04