Tungsten Through Silicon Vias for 3D high quality factor embedded RF MEMS inductors


Presented at:
39th International Conference on Micro and Nano Engineering, London, UK, September 16-19, 2013
Year:
2013
Laboratories:




 Record created 2013-11-04, last modified 2018-09-13


Rate this document:

Rate this document:
1
2
3
 
(Not yet reviewed)