000186777 001__ 186777
000186777 005__ 20181203023135.0
000186777 022__ $$a0167-9317
000186777 02470 $$2ISI$$a000326003600010
000186777 0247_ $$2doi$$a10.1016/j.mee.2013.04.040
000186777 037__ $$aARTICLE
000186777 245__ $$aFoil-to-foil lamination and electrical interconnection of printed components on flexible substrates
000186777 269__ $$a2013
000186777 260__ $$aAmsterdam$$bElsevier$$c2013
000186777 300__ $$a7
000186777 336__ $$aJournal Articles
000186777 520__ $$aThis paper describes and compares two integration methods to structurally laminate and interconnect foil-based components with flexible polymeric substrates. The first method uses isotropic conductive adhesives (ICA) confined in laser-ablated through foil vias (TFV), while the second one uses an anisotropic conductive adhesive (ACA). Both procedures were successfully demonstrated by interconnecting silverbased inkjet printed and gold-sputtered interdigitated capacitive humidity sensors onto flexible PEN carrier substrates, showing functionality, high process yield and low-complexity. The robustness of the assemblies was tested and compared for adhesion, bending, high humidity and temperature cycling. Confined ICA vias show higher mechanical robustness to bending, while both methods remained functional after more than 900 h of environmental ageing. Finally, the interconnections were fully validated at different levels of relative humidity (RH) by comparing the sensor response to that of a commercial sensor. (C) 2013 Elsevier B.V. All rights reserved.
000186777 6531_ $$aFoil-to-foil interconnection
000186777 6531_ $$aAnisotropic/isotropic conductive adhesives (ACA/ICA)
000186777 6531_ $$aLow-temperature lamination
000186777 6531_ $$aCyclic bending tests
000186777 6531_ $$aEnvironmental ageing
000186777 6531_ $$aFoil-based humidity sensing
000186777 700__ $$aVásquez Quintero, Andrés
000186777 700__ $$aVan Remoortere, Bart
000186777 700__ $$aSmits, Edsger C. P.
000186777 700__ $$aVan Den Brand, Jeroen
000186777 700__ $$0243293$$aBriand, Danick$$g188690
000186777 700__ $$aSchoo, Herman F. M.
000186777 700__ $$0243301$$ade Rooij, Nico F.$$g104887
000186777 773__ $$j110$$q52-58$$tMicroelectronic Engineering
000186777 909C0 $$0252173$$pSAMLAB$$xU10329
000186777 909CO $$ooai:infoscience.tind.io:186777$$particle
000186777 917Z8 $$x190047
000186777 937__ $$aEPFL-ARTICLE-186777
000186777 973__ $$aEPFL$$rNON-REVIEWED$$sPUBLISHED
000186777 980__ $$aARTICLE