On-Chip Cooling of Hot-Spots with a Copper Micro-Evaporator

Hot-spots are present in micro-electronics and are challenging to cool effectively. Using a copper micro-evaporator mounted on a pseudo-chip, on-chip two-phase cooling was found to very effectively cool the hot-spots without inducing flow instabilities. Building on a flow pattern-based prediction method developed for uniform heat flux conditions, the experimental results could be well predicted.


Published in:
2012 28Th Annual Ieee Semiconductor Thermal Measurement And Management Symposium (Semi-Therm), 125-129
Presented at:
28th Annual IEEE Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM)
Year:
2012
Publisher:
New York, Ieee
ISSN:
1065-2221
ISBN:
978-1-4673-1111-3
Laboratories:




 Record created 2013-02-27, last modified 2018-03-17


Rate this document:

Rate this document:
1
2
3
 
(Not yet reviewed)