000184674 001__ 184674
000184674 005__ 20180317092313.0
000184674 0247_ $$2doi$$a10.1088/1757-899X/33/1/012104
000184674 022__ $$a1757-8981
000184674 02470 $$2ISI$$a000307779900104
000184674 037__ $$aCONF
000184674 245__ $$a3D Phase-Field Simulation of Micropore Formation during Solidification: Morphological Analysis
000184674 269__ $$a2012
000184674 260__ $$aBristol$$bIop Publishing Ltd$$c2012
000184674 300__ $$a8
000184674 336__ $$aConference Papers
000184674 490__ $$aIOP Conference Series-Materials Science and Engineering
000184674 520__ $$aA 3D multiphase-field (PhF) model has been developed in order to study the formation of a micropore constrained to grow in a solid network (i.e., pinching effect). The model accounts for the pressure difference due to capillarity between liquid and gas, the equilibrium condition at triple (solid-liquid-pore) lines, the partitioning and diffusion of dissolved gases such as hydrogen. From the predicted 3D morphology of the pore, entities such as the Interfacial Shape Distribution (ISD) are plotted and analyzed. It is shown that the mean curvature of the pore-liquid surface, and thus also the pressure inside the pore, is uniform. Despite the complex morphology of pores reconstructed using high-resolution X-ray to mography, the present PhF results suggest that a simple pinching model based on a spherical tip growing in between remaining liquid channels is a fairly good approximation.
000184674 700__ $$aMeidani, H.
000184674 700__ $$0241504$$aJacot, A.$$g101989
000184674 700__ $$0241586$$aRappaz, M.$$g106186
000184674 7112_ $$a13th International Conference on Modeling of Casting, Welding and Advanced Solidification Processes (MCWASP)
000184674 720_1 $$aLudwig, A.$$eed.
000184674 773__ $$j33$$tMcwasp Xiii: International Conference On Modeling Of Casting, Welding And Advanced Solidification Processes
000184674 8564_ $$s4927550$$uhttps://infoscience.epfl.ch/record/184674/files/Meidani-Jacot-Rappaz-MCWASP2012.pdf$$yPostprint$$zPostprint
000184674 909CO $$ooai:infoscience.tind.io:184674$$pSTI$$pconf
000184674 909C0 $$0252075$$pLSMX$$xU10337
000184674 917Z8 $$x101178
000184674 937__ $$aEPFL-CONF-184674
000184674 973__ $$aEPFL$$rREVIEWED$$sPUBLISHED
000184674 980__ $$aCONF