000183748 001__ 183748
000183748 005__ 20190316235551.0
000183748 020__ $$a978-1-4673-3051-0
000183748 0247_ $$2doi$$a10.1109/ICCD.2012.6378637
000183748 037__ $$aCONF
000183748 245__ $$aThermal Characterization of Cloud Workloads on a Power-Efficient Server-on-Chip
000183748 269__ $$a2012
000183748 260__ $$c2012
000183748 336__ $$aConference Papers
000183748 520__ $$aWe propose a power-efficient many-core server-on-chip system with 3D-stacked Wide I/O DRAM targeting cloud workloads in datacenters. The integration of 3D-stacked Wide I/O DRAM on top of a logic die increases available memory bandwidth by using dense and fast Through-Silicon Vias (TSVs) instead of off-chip IOs, enabling faster data transfers at much lower energy per bit. We demonstrate a methodology that includes full-system microarchitectural modeling and rapid virtual physical prototyping with emphasis on the thermal analysis. Our findings show that while executing CPU-centric benchmarks (e.g. SPECInt and Dhrystone), the temperature in the server-on-chip (logic+DRAM) is in the range of 175-200C at a power consumption of less than 20W, exceeding the reliable operating bounds without any cooling solutions, even with embedded cores. However, with real cloud workloads, the power density in the server-on-chip remains much below the temperatures reached by the CPU-centric workloads as a result of much lower power burnt by memory-intensive cloud workloads. We show that such a server-on-chip system is feasible with a low-cost passive heat sink eliminating the need for a high-cost active heat sink with an attached fan, creating an opportunity for overall cost and energy savings in datacenters.
000183748 700__ $$aMilojevic, Dragomir
000183748 700__ $$aIdgunji, Sachin
000183748 700__ $$0243560$$g192049$$aJevdjic, Djordje
000183748 700__ $$aOzer, Emre
000183748 700__ $$0243555$$g184046$$aLotfi-Kamran, Pejman
000183748 700__ $$aPanteli, Andreas
000183748 700__ $$aProdromou, Andreas
000183748 700__ $$aNicopoulos, Chrysostomos
000183748 700__ $$aHardy, Damien
000183748 700__ $$aFalsafi, Babak$$g177958$$0243553
000183748 700__ $$aSazeides, Yiannakis
000183748 7112_ $$dSeptember 30 - October 3, 2012$$cMontreal, Quebec, Canada$$a30th IEEE International Conference on Computer Design
000183748 773__ $$tProceedings of the 30th IEEE International Conference on Computer Design
000183748 8564_ $$uhttps://infoscience.epfl.ch/record/183748/files/thermal_iccd12_1.pdf$$zn/a$$s1210302$$yn/a
000183748 909C0 $$xU11837$$0252231$$pPARSA
000183748 909CO $$qGLOBAL_SET$$pconf$$ooai:infoscience.tind.io:183748$$pIC
000183748 917Z8 $$x192049
000183748 917Z8 $$x192049
000183748 917Z8 $$x192049
000183748 917Z8 $$x184046
000183748 917Z8 $$x184046
000183748 917Z8 $$x184046
000183748 917Z8 $$x192049
000183748 917Z8 $$x192049
000183748 937__ $$aEPFL-CONF-183748
000183748 973__ $$rREVIEWED$$sPUBLISHED$$aEPFL
000183748 980__ $$aCONF