All-stencil transistor fabrication on 3D silicon substrates

The standard lithographic techniques to fabricate electronic components involve the use of polymers, baking steps and chemicals. This typically restricts their application to flat substrates made up of standard materials. Stencil lithography has been proposed as a stable alternative to the standard lithographic techniques. In this paper, we demonstrate the completely resistless all-through-stencil fabrication of electronic components, by performing all essential fabrication steps—implantation, etching and metallization—using stencil lithography. This is performed on a planar substrate as well as on pre-patterned 3D substrates, thus showing the potential of this technique for applications in the field of accelerometers, pressure, gas and radiation sensors.


Published in:
J. Micromech. Microeng., 22, 095022, 095022-1-6
Year:
2012
Publisher:
Bristol, Iop Publishing Ltd
Laboratories:


Note: The status of this file is: EPFL only


 Record created 2012-08-23, last modified 2018-09-13

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