000180647 001__ 180647
000180647 005__ 20190509132424.0
000180647 0247_ $$2doi$$a10.5075/epfl-thesis-5462
000180647 02470 $$2urn$$aurn:nbn:ch:bel-epfl-thesis5462-3
000180647 02471 $$2nebis$$a7341397
000180647 037__ $$aTHESIS
000180647 041__ $$aeng
000180647 088__ $$a5462
000180647 245__ $$a3D Integration Technology for Lab-on-a-Chip Applications
000180647 269__ $$a2012
000180647 260__ $$bEPFL$$c2012$$aLausanne
000180647 336__ $$aTheses
000180647 6531_ $$a3Dintegration
000180647 6531_ $$alab-on-a-chip
000180647 6531_ $$abiosensor
000180647 6531_ $$apoint-of-care diagnostics
000180647 6531_ $$aelectrochemical sensor
000180647 6531_ $$amicroelectrode
000180647 6531_ $$achip-to-chip (C2C) integration
000180647 6531_ $$athrough-silicon-via (TSV)
000180647 6531_ $$achip-level post-CMOS processing
000180647 700__ $$aTemiz, Yüksel
000180647 720_2 $$aLeblebici, Yusuf$$edir.$$g112194$$0240162
000180647 720_2 $$aGuiducci, Carlotta$$edir.$$g190693$$0243928
000180647 8564_ $$uhttps://infoscience.epfl.ch/record/180647/files/EPFL_TH5462.pdf$$zn/a$$s32631471$$yn/a
000180647 909C0 $$xU10325$$0252051$$pLSM
000180647 909C0 $$xU12017$$0252239$$pCLSE
000180647 909CO $$qDOI2$$qGLOBAL_SET$$pthesis$$pSTI$$pDOI$$ooai:infoscience.tind.io:180647
000180647 917Z8 $$x108898
000180647 917Z8 $$x108898
000180647 917Z8 $$x108898
000180647 918__ $$dEDMI$$cIBI-STI$$aSTI
000180647 920__ $$b2012
000180647 970__ $$a5462/THESES
000180647 973__ $$sPUBLISHED$$aEPFL
000180647 980__ $$aTHESIS