000180647 001__ 180647
000180647 005__ 20180501110000.0
000180647 0247_ $$2doi$$a10.5075/epfl-thesis-5462
000180647 02470 $$2urn$$aurn:nbn:ch:bel-epfl-thesis5462-3
000180647 02471 $$2nebis$$a7341397
000180647 037__ $$aTHESIS_LIB
000180647 041__ $$aeng
000180647 088__ $$a5462
000180647 245__ $$a3D Integration Technology for Lab-on-a-Chip Applications
000180647 269__ $$a2012
000180647 260__ $$aLausanne$$bEPFL$$c2012
000180647 336__ $$aTheses
000180647 6531_ $$a3Dintegration
000180647 6531_ $$alab-on-a-chip
000180647 6531_ $$abiosensor
000180647 6531_ $$apoint-of-care diagnostics
000180647 6531_ $$aelectrochemical sensor
000180647 6531_ $$amicroelectrode
000180647 6531_ $$achip-to-chip (C2C) integration
000180647 6531_ $$athrough-silicon-via (TSV)
000180647 6531_ $$achip-level post-CMOS processing
000180647 700__ $$aTemiz, Yüksel
000180647 720_2 $$0240162$$aLeblebici, Yusuf$$edir.$$g112194
000180647 720_2 $$0243928$$aGuiducci, Carlotta$$edir.$$g190693
000180647 8564_ $$s32631471$$uhttps://infoscience.epfl.ch/record/180647/files/EPFL_TH5462.pdf$$yn/a$$zn/a
000180647 909C0 $$0252051$$pLSM$$xU10325
000180647 909C0 $$0252239$$pCLSE$$xU12017
000180647 909CO $$ooai:infoscience.tind.io:180647$$pthesis$$pDOI2$$pDOI$$pSTI
000180647 917Z8 $$x108898
000180647 917Z8 $$x108898
000180647 917Z8 $$x108898
000180647 918__ $$aSTI$$cIBI-STI$$dEDMI
000180647 920__ $$b2012
000180647 970__ $$a5462/THESES
000180647 973__ $$aEPFL$$sPUBLISHED
000180647 980__ $$aTHESIS