Performance of self-healing epoxy with microencapsulated healing agent and shape memory alloy wires
We report the first measurements of a self-healing polymer that combines a microencapsulated liquid healing agent and shape memory alloy (SMA) wires. When a propagating crack ruptures the embedded microcapsules, the liquid healing agent is automatically released into the crack where it contacts a solid catalyst embedded in the matrix. The SMA wires are then activated to close the crack during the healing period. We show that dramatically improved healing performance is obtained by the activation of embedded SMA wires. We conclude that improved healing is due to a reduction of crack volume as a result of pulling the crack faces closed, and more complete polymerization of the healing agent due to the heat produced by the activated SMA wires. (C) 2009 Elsevier Ltd. All rights reserved.
[Kirkby, E. L. Michaud, V. J. Manson, J. -A. E.] Ecole Polytech Fed Lausanne, Inst Mat, Lab Technol Composites & Polymeres, CH-1015 Lausanne, Switzerland. [Sottos, N. R. White, S. R.] Univ Illinois, Auton Mat Syst Grp, Beckman Inst Adv Sci & Technol, Urbana, IL 61801 USA. Manson, JAE, Ecole Polytech Fed Lausanne, Inst Mat, Lab Technol Composites & Polymeres, CH-1015 Lausanne, Switzerland. email@example.com
ISI Document Delivery No.: 515TQ
Times Cited: 7
Cited Reference Count: 14
Kirkby, E. L. Michaud, V. J. Manson, J. -A. E. Sottos, N. R. White, S. R.
Swiss National Science Foundation [200020-105169]; AFOSR Aerospace and Material Science Directorate [FA9550-05-1-0346]
The authors gratefully acknowledge the financial support of the Swiss National Science Foundation (contract no. 200020-105169) and of AFOSR Aerospace and Material Science Directorate (grant no. FA9550-05-1-0346). Scott Robinson at the Imaging Technology Group, Beckman Institute of UIUC and Claire Delabarde at the Laboratoire de Technologie des Composites et Polymeres, EPFL are thanked for their assistance with scanning electron microscopy.
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Record created on 2012-06-29, modified on 2016-08-09