Journal article

A Qos-Enabled On-Die Interconnect Fabric For Kilo-Node Chips

To Meet Rapidly Growing Performance Demands And Energy Constraints, Future Chips Will Likely Feature Thousands Of On-Die Resources. Existing Network-On-Chip Solutions Weren'T Designed For Scalability And Will Be Unable To Meet Future Interconnect Demands. A Hybrid Network-On-Chip Architecture Called Kilo-Noc Co-Optimizes Topology, Flow Control, And Quality Of Service To Achieve Significant Gains In Efficiency.


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