Test Vehicle for Studying Thermal Conductivity of Die Attach Adhesives for High Temperature Electronics

Polymer adhesives offer a viable method for mounting silicon dies for high temperature applications. Here a test vehicle for comparing the thermal conductivity of different die attach materials is presented. The setup can be used to determine the degree of degradation of polymers. It consists of a mock die that has an integrated thick film heater, which is mounted onto a substrate. In operation, the substrate is placed on a heatsink and the die is heated. When the temperature reaches equilibrium the heater is switched off and the temperature of the die is measured as it cools. The time constant of the temperature decay is calculated to give the thermal conductivity. In this paper the thermal conductivity of an epoxy die attach adhesive is compared to its shear strength.


Editor(s):
Nicoară, Mircea
Răduţă, Aurel
Opriş, Carmen
Published in:
Solid State Phenomena, 188, 238-243
Presented at:
AMS’11, 4th International Conference on Advanced Materials and Structures, Timişoara, Romania, 27-28.10.2011
Year:
2012
Publisher:
Stafa-Zurich, Trans Tech Publications Ltd
Keywords:
Note:
Véhicule de test simple pour évaluer l'efficacité de la dissipation thermique des collages pour les modules électroniques.
Laboratories:




 Record created 2012-06-03, last modified 2018-01-28

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