3D sequential integration: a key enabling technology for heterogeneous co-integration of new function with CMOS


Published in:
Proceedings of the IEEE Circuits and Systems Society Forum on Emerging and Selected Topics (CAS-FEST)
Presented at:
IEEE Circuits and Systems Society Forum on Emerging and Selected Topics (CAS-FEST), Seoul, South Korea, May 20, 2012
Year:
2012
Laboratories:




 Record created 2012-05-07, last modified 2018-09-13


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