Stretchable and deformable macroelectronics
Wagner, S.; Lacour, S. P.; Hsu, P. H. I.; Sturm, J. C.; Suo, Z.
2003

Abstract

In this paper explained about the fabrication and evolution of integrated circuit. Here focusses an electronic skin and its components: the thin film, transistor backplane, the chemical sensor functional frontplane, and the computation and communication network. To date most work has gone into the backplane, some into exploring new functions., and little into circuit and network architectures.

Details

Title Stretchable and deformable macroelectronics
Author(s) Wagner, S. ; Lacour, S. P. ; Hsu, P. H. I. ; Sturm, J. C. ; Suo, Z.
Published in 61st Device Research Conference.
Pages 195-197
Conference 61st IEEE Device Research Conference., Salt Lake City, UT, USA, June 23-25, 2003
Date 2003
Publisher IEEE
DOI https://doi.org/10.1109/DRC.2003.1226929
Laboratories LSBI
Record Appears in Scientific production and competences > STI - School of Engineering > IEM - Institut d'Electricité et de Microtechnique > LSBI - Foundation Bertarelli Chair in Neuroprosthetic Technology
Peer-reviewed publications
Work outside EPFL
Conference Papers
Published
Record creation date 2012-05-01

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