000171987 001__ 171987
000171987 005__ 20180317095020.0
000171987 020__ $$a978-1-4244-8168-2
000171987 02470 $$2ISI$$a000287982100020
000171987 037__ $$aCONF
000171987 245__ $$aInductive Power Link for a Wireless Cortical Implant with Biocompatible Packaging
000171987 269__ $$a2010
000171987 260__ $$bIeee Service Center, 445 Hoes Lane, Po Box 1331, Piscataway, Nj 08855-1331 Usa$$c2010
000171987 336__ $$aConference Papers
000171987 490__ $$aIEEE Sensors
000171987 520__ $$aThis article presents an inductive power link for a cortical implant. The link includes a Class-E power amplifier, an inductive link, a matching network, and a rectifier. The coils of the inductive link are designed and optimized for a distance of 10mm (scalp thickness). The power amplifier is designed in order to allow closed loop power control by controlling the supply voltage. A new packaging topology is proposed in order to position the implant in the skull, without occupying much area, but still obtaining short distance between the remote powering coils. The package is fabricated using biocompatible materials such as PDMS and Parylene-C, and it includes the secondary coil, the matching network, and the rectifier. The power efficiency of the link is characterized for a wide range of load power (1-20mW) and found to be 8.1% for nominal load of 10mW. The matching network improves the power efficiency on the whole range, compared to the link without the matching network.
000171987 6531_ $$aDevices
000171987 700__ $$0244802$$aSilay, Kanber Mithat$$g175533
000171987 700__ $$0241196$$aDehollain, Catherine$$g107331
000171987 700__ $$0241433$$aDeclercq, Michel$$g104896
000171987 7112_ $$a2010 IEEE Sensors Conference$$cKona, HI$$dNov 01-04, 2010
000171987 773__ $$q94-98$$t2010 Ieee Sensors
000171987 8564_ $$s1948965$$uhttps://infoscience.epfl.ch/record/171987/files/05690844.pdf$$yn/a$$zn/a
000171987 909CO $$ooai:infoscience.tind.io:171987$$pconf$$pSTI
000171987 909C0 $$0252264$$pRFIC$$xU12148
000171987 909C0 $$0252174$$pLEG1
000171987 917Z8 $$x176554
000171987 937__ $$aEPFL-CONF-171987
000171987 973__ $$aEPFL$$rNON-REVIEWED$$sPUBLISHED
000171987 980__ $$aCONF