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Effects of Ni additions, trace elements and solidification kinetics on microstructure formation in Sn-0.7Cu solder
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Effects of Ni additions, trace elements and solidi[...]
-
Ventura, Tina
et al
main
file(s):
Ventura_Terzi_Rappaz_Dahle
version 1
Ventura_Terzi_Rappaz_Dahle.pdf
[1.18 MB]
03 Nov 2020, 13:47
Postprint