Microchannel-Based Liquid Interlayer Cooling in High-Performance 3D Stacks


Presented at:
16th IEEE European Test Symposium - Workshop on Low Power Design Impact on Test and Reliability , Trondheim, Norway, May 23-27, 2011
Year:
2011
Laboratories:




 Record created 2011-08-27, last modified 2018-03-17


Rate this document:

Rate this document:
1
2
3
 
(Not yet reviewed)