Pin-shape assessment for interlayer-cooled chip stacks with periodic boundary condition modeling
2010
Details
Title
Pin-shape assessment for interlayer-cooled chip stacks with periodic boundary condition modeling
Author(s)
Töral, Gözde ; Bender, R. ; Leblebici, Yusuf ; Brunschwiler, T.
Published in
Proceedings of the 16th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)
Pages
1-10
Conference
16th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC), Barcelona, Spain, October 6-8
Date
2010
Laboratories
LSM
Record Appears in
Scientific production and competences > STI - School of Engineering > IEM - Institut d'Electricité et de Microtechnique > LSM - Microelectronic Systems Laboratory
Peer-reviewed publications
Conference Papers
Work produced at EPFL
Published
Peer-reviewed publications
Conference Papers
Work produced at EPFL
Published
Record creation date
2011-04-07