Pin-shape assessment for interlayer-cooled chip stacks with periodic boundary condition modeling


Published in:
Proceedings of the 16th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC), 1-10
Presented at:
16th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC), Barcelona, Spain, October 6-8
Year:
2010
Laboratories:




 Record created 2011-04-07, last modified 2018-03-17


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