Die-Level TSV Fabrication Platform for CMOS-MEMS Integration
2011
Abstract
This paper reports a new post-CMOS processing platform for die-level through-silicon-via (TSV) fabrication, based on wafer reconstitution from embedded dies, parylene deposition, stencil lithography, and bottom-up electroplating. The goal of this work is to develop a heterogeneous 3D-integration technique for the applications requiring CMOS-MEMS integration with vertical interconnections.
Details
Title
Die-Level TSV Fabrication Platform for CMOS-MEMS Integration
Author(s)
Temiz, Yuksel ; Zervas, Michail ; Guiducci, Carlotta ; Leblebici, Yusuf
Published in
Proceedings of the 16th International Conference on Solid-State Sensors, Actuators and Microsystems (Transducers 2011)
Pages
1799-1802
Conference
The 16th International Conference on Solid-State Sensors, Actuators and Microsystems, Beijing, China, June 5-9, 2011
Date
2011
Additional link
URL
Record Appears in
Scientific production and competences > STI - School of Engineering > IBI-STI - Interfaculty Institute of Bioengineering > CLSE - Laboratory of Life Sciences Electronics
Scientific production and competences > STI - School of Engineering > IEM - Institut d'Electricité et de Microtechnique > LSM - Microelectronic Systems Laboratory
Peer-reviewed publications
Conference Papers
Work produced at EPFL
Published
Scientific production and competences > STI - School of Engineering > IEM - Institut d'Electricité et de Microtechnique > LSM - Microelectronic Systems Laboratory
Peer-reviewed publications
Conference Papers
Work produced at EPFL
Published
Record creation date
2011-03-21