Die-Level TSV Fabrication Platform for CMOS-MEMS Integration
Temiz, Yuksel; Zervas, Michail; Guiducci, Carlotta; Leblebici, Yusuf
2011

Abstract

This paper reports a new post-CMOS processing platform for die-level through-silicon-via (TSV) fabrication, based on wafer reconstitution from embedded dies, parylene deposition, stencil lithography, and bottom-up electroplating. The goal of this work is to develop a heterogeneous 3D-integration technique for the applications requiring CMOS-MEMS integration with vertical interconnections.

Details

Title Die-Level TSV Fabrication Platform for CMOS-MEMS Integration
Author(s) Temiz, Yuksel ; Zervas, Michail ; Guiducci, Carlotta ; Leblebici, Yusuf
Published in Proceedings of the 16th International Conference on Solid-State Sensors, Actuators and Microsystems (Transducers 2011)
Pages 1799-1802
Conference The 16th International Conference on Solid-State Sensors, Actuators and Microsystems, Beijing, China, June 5-9, 2011
Date 2011
DOI https://doi.org/10.1109/TRANSDUCERS.2011.5969555
Additional link URL
Laboratories LSM
CLSE
Record Appears in Scientific production and competences > STI - School of Engineering > IBI-STI - Interfaculty Institute of Bioengineering > CLSE - Laboratory of Life Sciences Electronics
Scientific production and competences > STI - School of Engineering > IEM - Institut d'Electricité et de Microtechnique > LSM - Microelectronic Systems Laboratory
Peer-reviewed publications
Conference Papers
Work produced at EPFL
Published
Record creation date 2011-03-21

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