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Low temperature pyrex/silicon wafer bonding via a single intermediate parylene layer
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Low temperature pyrex/silicon wafer bonding via a [...]
-
Ciftlik, Ata Tuna
et al
main
file(s):
06-033
version 3
(see
previous
)
06-033.pdf
[706.5 KB]
27 Jan 2018, 13:30
n/a