3D Assembly Using Au-Si Eutectic and Au-Au Thermocompression Wafer Level Bonding for M(O)EMS Device Fabrication
2010
Details
Title
3D Assembly Using Au-Si Eutectic and Au-Au Thermocompression Wafer Level Bonding for M(O)EMS Device Fabrication
Author(s)
Lani, Sébastien ; Canonica, Michael ; Bayat, Dara ; Ataman, Caglar ; Noell, Wilfried ; de Rooij, Nico
Published in
ECS Transactions
Volume
33
Issue
4
Pages
37-46
Date
2010
Laboratories
SAMLAB
Record Appears in
Scientific production and competences > STI - School of Engineering > STI Archives > SAMLAB - Sensors, Actuators and Microsystems Laboratory
Work produced at EPFL
Journal Articles
Published
Work produced at EPFL
Journal Articles
Published
Record creation date
2011-02-16