FABRICATION AND CHARACTERIZATION OF 3D INTEGRATED 2 DOF MICROMIRROR ARRAYS FOR EXCESSIVE THERMAL LOADS

This paper reports a high fill-factor (>90%), 2-dimensional analog micromirror array designed specifically for very high, optically induced thermal load applications. Each pixel can attain a mechanical DC rotation angle of ±4 degrees around any arbitrary axis with 170V excitation. The maximum temperature rise on the mirror surface with 7 KW/m2 thermal load under 1 Pa ambient pressure is below 230 °C. A detailed assessment of the fabrication process –including the poly-Si vertical electrodes, wafer level mirror bonding, and copper electroplating of structural layers–, and characterization methodology is presented with experimental results.


Presented at:
MEMS 2011, Cancun, Mexico, January 23-27, 2011
Year:
2011
Publisher:
Ieee Service Center, 445 Hoes Lane, Po Box 1331, Piscataway, Nj 08855-1331 Usa
Laboratories:




 Record created 2011-02-08, last modified 2018-09-13


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