Fast in situ metallization: a comparison of several methods with possible applications in high-density multichip interconnects

A review with 74 refs. is given on fabrication of metalizations and interconnects in microelectronics. An application of metal complexes for laser-assisted CVD is described. Different methods for pre-nucleation and developing of films and lines are discussed.


Editor(s):
Boyd, Ian W.
Jackman, Richard B.
Published in:
Photochemical processing of electronic materials, 433-463
Presented at:
5th UK Photochemical Processing Workshop, University College, London, UK
Year:
1992
Publisher:
London, Academic Press
ISBN:
0-12-121740-X
Keywords:
Note:
Copyright 2003 ACS
CAPLUS
AN 1993:70917
CAN 118:70917
76-0
Electric Phenomena
Lab. Chim. Techn.,Ec. Polytech. Fed.,Lausanne,Switz. FIELD URL:
Conference; General Review
58NQAU
written in English.
Laser radiation (in fabrication of multitip interconnects); Electric circuits (integrated, metalization for, laser in fast in situ); Electric conductors (interconnections, fast in situ metalization technol. of); Vapor deposition processes (photochem., for metalization deposition)
Laboratories:




 Record created 2011-02-01, last modified 2018-01-28


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