Fast in situ metallization: a comparison of several methods with possible applications in high-density multichip interconnects
A review with 74 refs. is given on fabrication of metalizations and interconnects in microelectronics. An application of metal complexes for laser-assisted CVD is described. Different methods for pre-nucleation and developing of films and lines are discussed.
Copyright 2003 ACS
Lab. Chim. Techn.,Ec. Polytech. Fed.,Lausanne,Switz. FIELD URL:
Conference; General Review
written in English.
Laser radiation (in fabrication of multitip interconnects); Electric circuits (integrated, metalization for, laser in fast in situ); Electric conductors (interconnections, fast in situ metalization technol. of); Vapor deposition processes (photochem., for metalization deposition)
Record created on 2011-02-01, modified on 2016-09-16