Fast in situ metallization: a comparison of several methods with possible applications in high-density multichip interconnects
Widmer, Marcel; Hoffmann, Patrik; Lecohier, Baudouin; Solka, Herbert; Philippoz, Jean Michel; Van den Bergh, Hubert
1992

Abstract

A review with 74 refs. is given on fabrication of metalizations and interconnects in microelectronics. An application of metal complexes for laser-assisted CVD is described. Different methods for pre-nucleation and developing of films and lines are discussed.

Details

Title Fast in situ metallization: a comparison of several methods with possible applications in high-density multichip interconnects
Author(s) Widmer, Marcel ; Hoffmann, Patrik ; Lecohier, Baudouin ; Solka, Herbert ; Philippoz, Jean Michel ; Van den Bergh, Hubert
Published in Photochemical processing of electronic materials
Editor(s)
Pages 433-463
Conference 5th UK Photochemical Processing Workshop, University College, London, UK
Date 1992
Publisher London, Academic Press
ISBN 0-12-121740-X
Keywords
Note Copyright 2003 ACS
CAPLUS
AN 1993:70917
CAN 118:70917
76-0
Electric Phenomena
Lab. Chim. Techn.,Ec. Polytech. Fed.,Lausanne,Switz. FIELD URL:
Conference; General Review
58NQAU
written in English.
Laser radiation (in fabrication of multitip interconnects); Electric circuits (integrated, metalization for, laser in fast in situ); Electric conductors (interconnections, fast in situ metalization technol. of); Vapor deposition processes (photochem., for metalization deposition)
Laboratories LPAS
LOA
Record Appears in Scientific production and competences > ENAC - School of Architecture, Civil and Environmental Engineering > ENAC Archives > LPAS - Air and Soil Pollution Laboratory
Scientific production and competences > STI - School of Engineering > STI Archives > LOA - Advanced Photonics Laboratory
Peer-reviewed publications
Conference Papers
Work produced at EPFL
Published
Record creation date 2011-02-01

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