The influence of water vapor on the selective low pressure CVD of copper
Low pressure CVD of Cu from its bis-hexafluoroacetylacetonate was studied on oxidized Si substrates locally seeded with a 2.5 .ANG. Pt prenucleation film.
Keywords: 7440-50-8 (Copper) Role: PEP (Physical ; engineering or chemical process) ; PROC (Process) (film deposition of ; effect of water vapor on); 14781-45-4 Role: USES (Uses) (in copper vapor deposition ; effect of water vapor on); 7732-18-5 (Water) Role: USES (U ; water vapor CVD copper fluoroacetylacetonate; platinum prenucleation copper oxidized silicon
Copyright 2003 ACS
Lab. Chim. Tech.,Ec. Polytech. Fed. Lausanne,Lausanne,Switz. FIELD URL:
written in English.
Vapor deposition processes (organometallic, of copper, effect of water vapor on)
Record created on 2011-02-01, modified on 2016-08-09