The influence of water vapor on the selective low pressure CVD of copper

Lecohier, B.; Philippoz, J. M.; Calpini, B.; Stumm, T.; Van den Bergh, H.

doi:10.1051/jp4:1991234

The influence of water vapor on the selective low pressure CVD of copper

Lecohier, B. ; Philippoz, J. M. ; Calpini, B. ; Stumm, T.[...]

Low pressure CVD of Cu from its bis-hexafluoroacetylacetonate was studied on oxidized Si substrates locally seeded with a 2.5 .ANG. Pt prenucleation film.

Published in:

Journal Physics IV France, 2, C2, C2-279 - C2-286

Year:

1991

Keywords:

7440-50-8 (Copper) Role: PEP (Physical ; engineering or chemical process) ; PROC (Process) (film deposition of ; effect of water vapor on); 14781-45-4 Role: USES (Uses) (in copper vapor deposition ; effect of water vapor on); 7732-18-5 (Water) Role: USES (U ; water vapor CVD copper fluoroacetylacetonate; platinum prenucleation copper oxidized silicon

Note:

Copyright 2003 ACS
CAPLUS
AN 1992:73396
CAN 116:73396
76-2
Electric Phenomena
75
Lab. Chim. Tech.,Ec. Polytech. Fed. Lausanne,Lausanne,Switz. FIELD URL:
Journal
JPICEI
written in English.
Vapor deposition processes (organometallic, of copper, effect of water vapor on)

DOI:

10.1051/jp4:1991234

Laboratories:

LPAS

Record appears in:

Scientific production and competences > Archives > ENAC - School of Architecture, Civil and Environmental Engineering > LPAS - Air and Soil Pollution Laboratory
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