Selective copper film growth on platinum clusters

Two-step spatially delineated growth of copper lines from a solid copper formate layer on a surface is demonstrated. In the first step, a localized platinum film, less than 10 .ANG. high, is deposited. Subsequently the whole surface is covered by a few microns of Cu(HCOO)2.2H2O. Heating to about 70 Deg causes the formate to decomp. exclusively where the surface had been seeded with the thin film of platinum clusters. Line resistivities of about twice that of pure bulk copper can be obtained in this way. In principle this method should permit direct writing of metal stripes at very high speeds and good spatial resoln.


Published in:
Applied Surface Science, 43, 1-2, 61-67
Year:
1989
Keywords:
Note:
Copyright 2003 ACS
CAPLUS
AN 1990:149667
CAN 112:149667
76-2
Electric Phenomena
66
Lab. Chim. Tech.,Ec. Polytech. Fed. Lausanne,Lausanne,Switz. FIELD URL:
Journal
ASUSEE
written in English.
Electric conductors (copper, selective growth of lines of, by copper formate decompn. on platinum clusters); Electric resistance (of copper lines from selective growth on platinum clusters)
Laboratories:




 Record created 2011-02-01, last modified 2018-01-28


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