000162436 001__ 162436
000162436 005__ 20190316235021.0
000162436 037__ $$aCONF
000162436 245__ $$aAnalytical Heat Transfer Model for Thermal Through-Silicon Vias
000162436 269__ $$a2011
000162436 260__ $$c2011
000162436 336__ $$aConference Papers
000162436 520__ $$aThermal issues are one of the primary challenges in 3-D integrated circuits. Thermal through-silicon vias (TTSVs) are considered an effective means to reduce the temperature of 3-D ICs. The effect of the physical and technological parameters of TTSVs on the heat transfer process within 3-D ICs is investigated. Two resistive networks are utilized to model the physical behavior of TTSVs. Based on these models, closed-form expressions are provided describing the flow of heat through TTSVs within a 3-D IC. The accuracy of these models is compared with results from a commercial FEM tool. For an investigatedthree-plane circuit, the average error of the first and second models is 2% and 4%, respectively. The effect of the physical parameters of TTSVs on the resulting temperature is described through the proposed models. For example, the temperature changes non-monotonically with the thickness of the silicon substrate. This behavior is not described by the traditional single thermal resistance model. The proposed models are used for the thermal analysis of a 3-D DRAM-uP system where the conventional model is shown to considerably overestimate the temperature of the system.
000162436 6531_ $$a3-D ICs, Thermal through-silicon via (TTSV), thermal resistance, heat conductivity
000162436 700__ $$0242420$$g183772$$aXu, Hu
000162436 700__ $$aPavlidis, Vasilis F.
000162436 700__ $$aDe Micheli, Giovanni$$g167918$$0240269
000162436 7112_ $$dMarch 14-18, 2011$$cGrenoble, France$$aDesign, Automation and Test in Europe (DATE 2011)
000162436 773__ $$tProceedings of Design, Automation and Test in Europe Conference
000162436 8564_ $$uhttps://infoscience.epfl.ch/record/162436/files/Analytical%20Heat%20Transfer%20Model_DATE2011.pdf$$zn/a$$s268201$$yn/a
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000162436 917Z8 $$x112915
000162436 917Z8 $$x112915
000162436 937__ $$aEPFL-CONF-162436
000162436 973__ $$rREVIEWED$$sPUBLISHED$$aEPFL
000162436 980__ $$aCONF