Physical Design Tradeoffs in Power Distribution Networks for 3-D ICs

A physical model for the design of the power distribution networks in three-dimensional integrated circuits is proposed. The tradeoffs among the different design parameters are specified and analyzed. Different case studies are explored, indicating that smaller and denser TSVs can deliver power more efficiently as compared to larger and coarsely distributed TSVs. The interplay between the TSV count and the intra-plane power distribution network in reducing the power supply noise is also shown.


Published in:
Proceedings of the 17th IEEE International Conference on Electronics, Circuits, and Systems (ICECS 2010), 435-438
Presented at:
17th IEEE International Conference on Electronics, Circuits, and Systems (ICECS 2010), Athens, Greece, December 12-15, 2010
Year:
2010
Keywords:
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 Record created 2010-12-22, last modified 2018-09-25

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