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Design and Feasibility of Multi-Gb/s Quasi-Serial Vertical Interconnects based on TSVs for 3D ICs
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Design and Feasibility of Multi-Gb/s Quasi-Serial [...]
-
Sun, Fengda
et al
main
file(s):
vlsisoc2010_submission_71_CR_redo
version 2
(see
previous
)
vlsisoc2010_submission_71_CR_redo.pdf
[404.22 KB]
27 Jan 2018, 13:25
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