000154160 001__ 154160
000154160 005__ 20180913060041.0
000154160 037__ $$aPOST_TALK
000154160 245__ $$aLow Temperature Indium-based Sealing of Microfabricated Alkali Cells for Chip Scale Atomic Clocks 
000154160 260__ $$c2010
000154160 269__ $$a2010
000154160 336__ $$aPosters
000154160 520__ $$aIn  this  paper,  the  development  of  a  low  temperature  bonding  process  focused  on  indium-based  technology  for microfabricated alkali cells is presented. The intended application is the use of these cells in chip scale atomic clocks.   The existing technology is mainly based on anodic bonding. For some applications, such as where wall coating is used instead of buffer gas, anodic bonding cannot be applied because of the relatively high temperature of the process.         
000154160 700__ $$0243288$$aPétremand, Yves$$g187562
000154160 700__ $$aSchori, C.
000154160 700__ $$0243306$$aSträssle, Rahel$$g192116
000154160 700__ $$aMileti, G.
000154160 700__ $$0243301$$ade Rooij, Nico$$g104887
000154160 700__ $$aThomann, P.
000154160 7112_ $$a24th European Frequency and Time Forum EFTF 2010$$cNoordwijk, Netherlands$$dApril 13-16, 2010
000154160 909C0 $$0252173$$pSAMLAB$$xU10329
000154160 909CO $$ooai:infoscience.tind.io:154160$$pposter
000154160 917Z8 $$x190047
000154160 917Z8 $$x190047
000154160 937__ $$aEPFL-POSTER-154160
000154160 973__ $$aEPFL$$sPUBLISHED
000154160 980__ $$aPOSTER