Mold metallization process for the batch fabrication of high-resolution MRI solenoidal micro-coils enabling low loss integration of electronic devices
We present a general metallization process for the fabrication of solenoidal micro-coils for high resolution MRI of volume-limited samples. The process allows for the MEMS-compatible batch fabrication of identical coils. Hollow conductors are integrated within a planar wafer geometry, enabling the low loss connection to external tuning/matching devices. A high filling-factor is achieved by the small coil dimensions and thin sample container walls, and the solenoidal geometry ensures a homogeneous magnetic field. Glass wafers were chosen as base substrate for their superior dielectric properties as compared to silicon, additionally allowing for simultaneous optical observation of the inserted sample.
Record created on 2010-07-13, modified on 2016-08-08