Numerical analysis of temperature elevation in the head due to power dissipation in a cortical implant
2008
Details
Title
Numerical analysis of temperature elevation in the head due to power dissipation in a cortical implant
Author(s)
Silay, K. M. ; Dehollain, C. ; Declercq, M.
Published in
Engineering in Medicine and Biology Society, 2008. EMBS 2008. 30th Annual International Conference of the IEEE
Pages
951-956
Date
2008
ISSN
1557-170X
Keywords
Other identifier(s)
View record in Web of Science
Laboratories
SCI-STI-CD
Record Appears in
Peer-reviewed publications
Conference Papers
Work produced at EPFL
Published
Conference Papers
Work produced at EPFL
Published
Record creation date
2010-05-21