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Validation of the porous-medium approach to model interlayer-cooled 3D-chip stacks
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Validation of the porous-medium approach to model [...]
-
Brunschwiler, T.
et al
main
file(s):
Brunschwiler_et_al_3DIC09-4
version 3
(see
previous
)
Brunschwiler_et_al_3DIC09-4.pdf
[2.55 MB]
27 Jan 2018, 13:19
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