High aspect ratio UV photolithography for electroplated structures
This paper describes single and two layer processes to realize thick resist moulds (40 and 80 μm) with a good reproducibility. The patterning of a thick AZ 4562 photoresist layer is performed with standard photolithography equipment. Different problems related to thick photoresist patterning (edge bead, resist cracking,...) are discussed and solutions are proposed. Side walls are characterized after nickel electrodeposition and mould dissolution in acetone. Results, process limitations and applications are presented.
Record created on 2009-05-12, modified on 2016-08-08