Wafer level hermetic package and device testing of a SOI-MEMS switch for biomedical applications

We have designed a wafer level chip scale package for a bi-stable SOI-MEMS dc switch using a silicon-glass hermetic seal with through the lid feedthroughs. Bonded at 365 °C, 230 V and 250 kg, they pass the fine/gross leak test after thermal cycling and mechanical shock/vibration according to MIL-STD-833, fulfilling the requirements for biomedical applications. The measured shear strength is 114 26 N in correspondence with the theoretically expected 100 N. Ruthenium microcontacts are a factor of 100 more robust than gold microcontacts, being stable over 106 cycles measured in a N2 atmosphere inside the package presented here. Future work will include a more extensive bond quality assessment and continued microcontact reliability measurements. © 2006 IOP Publishing Ltd.


Published in:
Journal of Micromechanics and Microengineering, 16, 4, 676-683
Year:
2006
ISSN:
09601317
Note:
364
Laboratories:




 Record created 2009-05-12, last modified 2018-03-17


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