High-Precision Aligned Silicon Wafer Bonding for a Micromachined AFM Sensor
1993
Details
Title
High-Precision Aligned Silicon Wafer Bonding for a Micromachined AFM Sensor
Author(s)
Brugger, J. ; Jaecklin, V. P. ; Linder, C. ; Blanc, N. ; de Rooij, N. F.
Published in
2nd Int. Symp. On Semiconductor Wafer Bonding: Science Technology and Applications
Volume
93-29
Pages
363-372
Date
1993
Laboratories
SAMLAB
Record Appears in
Scientific production and competences > STI - School of Engineering > STI Archives > SAMLAB - Sensors, Actuators and Microsystems Laboratory
Work outside EPFL
Conference Papers
Published
Work outside EPFL
Conference Papers
Published
Record creation date
2009-05-12