Low numerical aperture refractive microlenses in fused silica

Fused silica microlenses with low numerical apertures (NAs) were fabricated. The original photoresist element was realized by the melting resist technology and was transferred into fused silica by reactive ion etching. Low selectivity etching was applied to realize the low NA microlenses. An etch selectivity between photoresist and fused silica down to 0.1 was achieved by using SF6 and O2 gases. Refractive microlenses with NAs down to 0.018 were obtained.


Published in:
Opt. Eng., 40, 1412-1414
Year:
2001
Keywords:
Laboratories:




 Record created 2009-04-22, last modified 2018-03-17


Rate this document:

Rate this document:
1
2
3
 
(Not yet reviewed)