Low-power hermetically sealed on-chip plasma light source micromachined in glass

We report on the fabrication and testing of a chip-scale plasma light source. The device consists of a stack of three anodically bonded Pyrex wafers, which hermetically enclose a gas-filled cavity in which electrodes are used to ignite a low power (≪500 mW) RF plasma.


Published in:
Proceedings of the MEMS’08 Conference, 1, 818-821
Presented at:
MEMS’08
Year:
2008
Laboratories:


Note: The status of this file is: EPFL only


 Record created 2009-02-02, last modified 2018-03-17

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