000128136 001__ 128136
000128136 005__ 20190316234405.0
000128136 037__ $$aCONF
000128136 245__ $$aFormulation and processing of screen-printing vehicles for sacrificial layers on thick-film and LTCC substrates
000128136 269__ $$a2008
000128136 260__ $$c2008
000128136 336__ $$aConference Papers
000128136 520__ $$aCeramic technologies such as thick-film and LTCC (Low Temperature Cofired Ceramic) are excellent platforms for the fabrication of mesoscale devices such as sensors, actuators, microreactors and MEMS packaging. This work presents two alternative screen-printing vehicles for the processing of sacrificial materials and low-firing thick films: 1) a non-aggressive glycol-based vehicle for screen printing thick sacrificial layers onto thin LTCC, and 2) a "high non-evaporables" vehicle for mineral / carbon sacrificial materials allowing subsequent overprinting in the dried state. Their formulation, processing and applications are discussed with regard to the physical and chemical properties of the solvents, plasticisers and binders.
000128136 6531_ $$aThick-film technology
000128136 6531_ $$aStructuration
000128136 6531_ $$aSacrificial layers
000128136 6531_ $$aScreen-printing vehicles
000128136 6531_ $$aFormulation
000128136 700__ $$0240386$$aMaeder, Thomas$$g102445
000128136 700__ $$0241293$$aJacq, Caroline$$g143964
000128136 700__ $$0242856$$aFournier, Yannick$$g140857
000128136 700__ $$0240512$$aRyser, Peter$$g115532
000128136 7112_ $$aXXXII International Conference of IMAPS Poland Chapter$$cPułtusk, Poland$$dSeptember 21-24, 2008
000128136 8564_ $$uhttp://www.imaps.org.pl/$$zURL
000128136 8564_ $$s527524$$uhttps://infoscience.epfl.ch/record/128136/files/2008%20Maeder%20IMAPS-PL%20Pultusk%20v%C3%A9hicules%20de%20s%C3%A9rigraphie.pdf$$yPreprint$$zPreprint
000128136 8564_ $$s1186562$$uhttps://infoscience.epfl.ch/record/128136/files/2008%20Maeder%20IMAPS-PL%20Pultusk%20v%C3%A9hicules%20de%20s%C3%A9rigraphie%20-%20poster.pdf$$yPoster$$zPoster
000128136 909C0 $$0252100$$pLPM
000128136 909CO $$ooai:infoscience.tind.io:128136$$pconf$$qGLOBAL_SET
000128136 917Z8 $$x102445
000128136 937__ $$aLPM-CONF-2008-020
000128136 973__ $$aEPFL$$rREVIEWED$$sPUBLISHED
000128136 980__ $$aCONF