Resistivity Measurements of Gold Wires Fabricated by Stencil Lithography on Flexible Polymer Substrates
We report on the patterning and characterization of titanium–gold (Ti–Au) wire test structures on polyethylene naphthalate (PEN), polyethylene terephthalate (PET) and polyimide (PI) substrates. PEN, PET and PI are flexible polymers which can withstand stress and strain. The used patterning method is stencil lithography, a resistless patterning method and based on the shadow mask technique. From the electrical characterization, the resistivity of the Ti–Au wires on the different flexible substrates was determined.