Resistivity Measurements of Gold Wires Fabricated by Stencil Lithography on Flexible Polymer Substrates

We report on the patterning and characterization of titanium–gold (Ti–Au) wire test structures on polyethylene naphthalate (PEN), polyethylene terephthalate (PET) and polyimide (PI) substrates. PEN, PET and PI are flexible polymers which can withstand stress and strain. The used patterning method is stencil lithography, a resistless patterning method and based on the shadow mask technique. From the electrical characterization, the resistivity of the Ti–Au wires on the different flexible substrates was determined.


Published in:
Microelectronic Engineering, 85, 1108–1111
Year:
2008
Publisher:
Elsevier
ISSN:
0167-9317
Laboratories:


Note: The status of this file is: EPFL only


 Record created 2008-06-12, last modified 2018-09-13

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