000124669 001__ 124669
000124669 005__ 20190812205227.0
000124669 02470 $$2ISI$$a000256625700240
000124669 037__ $$aCONF
000124669 245__ $$aRetest of the TFAS1 sample with solder filled extremities
000124669 269__ $$a2007
000124669 260__ $$c2007
000124669 336__ $$aConference Papers
000124669 500__ $$aMT-20 - IEEE Trans. Appl. Supercond.
000124669 700__ $$0240062$$g134508$$aStepanov, B.
000124669 700__ $$0240063$$g113537$$aBruzzone, P.
000124669 700__ $$0240064$$g106730$$aWesche, R.
000124669 700__ $$g177972$$aBagnasco, M.$$0242249
000124669 700__ $$aVogel, M.
000124669 700__ $$aCiaxynski, D.
000124669 700__ $$aMartoveski, N.
000124669 7112_ $$d27 August 2007$$cPhiladelphia, Penn, USA$$aMT-20, International Conference on Magnet Technology
000124669 773__ $$j18 (2008)$$tIEEE Trans. Appl. Supercond.$$q1080
000124669 8564_ $$zURL$$uhttp://www.mt-Conference.org/main.asp
000124669 909C0 $$pCRPP
000124669 909C0 $$xU12272$$pSPC$$0252028$$xU12268$$xU10558$$xU10635$$xU12266$$xU10636$$xU10137$$xU12270$$xU10557$$xU12273$$xU10559$$xU12271$$xU12269$$xU12267$$xU10136
000124669 909CO $$qGLOBAL_SET$$pconf$$pSB$$ooai:infoscience.tind.io:124669
000124669 917Z8 $$x105759
000124669 937__ $$aCRPP-CONF-2007-100
000124669 970__ $$a4356-CONF/CRPP
000124669 973__ $$rREVIEWED$$sPUBLISHED$$aEPFL
000124669 980__ $$aCONF