Retest of the TFAS1 sample with solder filled extremities


Published in:
IEEE Transactions on Applied Superconductivity, 18, 2, 1080-1083
Presented at:
MT-20, International Conference on Magnet Technology, Philadelphia, Penn, USA, 27 August 2007
Year:
2007
Other identifiers:
Laboratories:
SPC
CRPP




 Record created 2008-05-13, last modified 2020-07-30

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