Low-power hermetically sealed on-chip plasma light source micromachined in glass

We report on the fabrication and testing of a chip-scale plasma light source. The device consists of a stack of three anodically bonded Pyrex wafers, which hermetically enclose a gas-filled cavity in which electrodes are used to ignite a low power (≪500 mW) RF plasma.


Presented at:
21st IEEE International Conference on Micro Electro Mechanical Systems, 2008, Tuscon, AZ, 13-17 Jan. 2008
Year:
2008
Laboratories:




 Record created 2008-02-13, last modified 2018-03-17

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