Innovative Manufacturing Technology for RF Passive Devices Combining Electroforming and CFRP Application

In this paper an innovative manufacturing technology is presented that combines electroforming and CFRP application and thus could be an enabling technology to achieve tuningless lightweight RF passive hardware with complex geometries. In order to demonstrate the performances achievable with this manufacturing process, a highly sensitive 0.14% fractional bandwidth dual mode filter centered at 19.8GHz was fabricated and tested. The flange interface of the filter was an integral part of the hardware and the total weight four times lighter than an equivalent part made from INVAR.


Published in:
IEEE MTT-S International Microwave Symposium Digest, 2008
Presented at:
2008 International Microwave Symposium, Atlanta, GA, USA, 15-20 June 2008
Year:
2008
Publisher:
Atlanta, GA, USA
Keywords:
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 Record created 2008-01-29, last modified 2018-01-28

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