Copper/polyimide fabrication process for above-IC integration of high quality factor inductors
2004
Details
Title
Copper/polyimide fabrication process for above-IC integration of high quality factor inductors
Author(s)
Pisani, M. B. ; Hibert, C. ; Bouvet, D. ; Beaud, P. ; Ionescu, A. M.
Published in
Microelectronics Engineering
Volume
73-74
Pages
474-479
Conference
Micro and Nano Engineering 2003, Cambridge, UK, 22-25 September 2003
Date
2004
Other identifier(s)
DAR: 5304
View record in Web of Science
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Record Appears in
Scientific production and competences > STI - School of Engineering > IEM - Institut d'Electricité et de Microtechnique > NANOLAB - Nanoelectronic Devices Laboratory
Scientific production and competences > STI - School of Engineering > CMI - Center of MicroNanoTechnology
Peer-reviewed publications
Work produced at EPFL
Journal Articles
Published
Scientific production and competences > STI - School of Engineering > CMI - Center of MicroNanoTechnology
Peer-reviewed publications
Work produced at EPFL
Journal Articles
Published
Record creation date
2007-10-10