Modeling Techniques and Verification Methodologies for Substrate Coupling Effects in Mixed-Signal System-on-Chip Designs


Published in:
IEEE Transactions on Computer-Aided Design of Integration Circuits and Systems, 23, 6, pp. 823-829
Year:
2004
Other identifiers:
Laboratories:




 Record created 2007-10-08, last modified 2018-12-03


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