Files

Action Filename Description Size Access License Resource Version
Show more files...

Abstract

The continuous improvements in conventional lithography methods for integrated circuit hardware allow further device shrinkage deep into the sub-micron dimensions. Two major drawbacks of these high-end patterning methods based on photoresist technologies are i) their high process costs and ii) their limited process versatility. Increased flexibility, however, becomes important for the engineering of advanced nano/micro-electro-mechanical systems (NEMS/MEMS), such as ultra-thin solid-state membrane or cantilever devices, polymer-based devices, micro/nanofluidics, and bio-analytical systems. Often standard lithography methods cannot be applied on unconventional materials, because the surfaces to be structured are either mechanically unstable and/or (bio-) chemically functionalized. Bottom-up methods relying on self-assembling strategies are making tremendous progress to form ordered structures with nanometer precision, but they still lack control on a larger scale. The key aspect in the near future is to find new ways to tie top-down and bottom-up methods together, and to connect structures across the nano/micro gap so that the improved effects relying on nanometer dimensions can be efficiently scaled-up. Recently, a series of new, alternative surface patterning methods related to MEMS technology have been developed, such as molecule delivery via DipPen/NADIS lithography or soft-lithography, thermo-mechanical indentation by Nanoimprint lithography, or local deposition via nanostencils. Due to their versatility and multiple length-scale capabilities they have great potential to form bridges between nano and micro-world. We will present some examples of our contribution to the field of MEMS and Nanotechnology, such as large area nanostencil based on a DUV/MEMS membrane, NEMS devices, functional SAM layers for MEMS, self-assembled nanowire sensors, nanoscale Hall-probe on surface released polymer cantilevers, and focused ion beam (FIB) and focused electron beam (FEB) nanofabrication. Some of these examples are presented in detail during TNT’04.

Details

Actions