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  4. A novel high-throughput on-wafer electromechanical sensitivity characterization system for piezoresistive cantilevers
 
conference paper

A novel high-throughput on-wafer electromechanical sensitivity characterization system for piezoresistive cantilevers

Tosolini, G.
•
Villanueva, L. G.  
•
Perez-Murano, F.
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2012
26th IEEE International Conference on Microelectronic Test Structures (ICMTS)
26th IEEE International Conference on Microelectronic Test Structures (ICMTS)

In this work we present the development of a new set-up that allows on-wafer sensitivity characterization of piezoresistive cantilevers. In this way we reduce considerably the testing time compared to the techniques available up to date but at the same time we maintain a high measurement precision. Moreover it can be easily used for characterization of broad types of batch fabricated micro- and nanoelectromechanical systems (MEMS and NEMS). Together with the sensitivity measurement we present also the methods to test the cantilever spring constant and the electrical noise. Using these techniques we measured the performance of multiple piezoresistive cantilevers in two wafers and from these values we extracted important fabrication materials parameters such as Young modulus, Hooge and piezoresistive factors. © 2012 IEEE.

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Type
conference paper
DOI
10.1109/ICMTS.2012.6190613
Author(s)
Tosolini, G.
Villanueva, L. G.  
Perez-Murano, F.
Bausells, J.
Date Issued

2012

Published in
26th IEEE International Conference on Microelectronic Test Structures (ICMTS)
Start page

55

End page

60

Editorial or Peer reviewed

REVIEWED

Written at

OTHER

EPFL units
NEMS  
Event nameEvent placeEvent date
26th IEEE International Conference on Microelectronic Test Structures (ICMTS)

San Diego, USA

2012

Available on Infoscience
August 6, 2013
Use this identifier to reference this record
https://infoscience.epfl.ch/handle/20.500.14299/93847
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