Loading...
research article
3D Assembly Using Au-Si Eutectic and Au-Au Thermocompression Wafer Level Bonding for M(O)EMS Device Fabrication
2010
Type
research article
Author(s)
Date Issued
2010
Published in
Volume
33
Issue
4
Start page
37
End page
46
Peer reviewed
NON-REVIEWED
Written at
EPFL
EPFL units
Available on Infoscience
February 16, 2011
Use this identifier to reference this record