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  4. Tying top down to bottom up: Nano-engineering between bolecular and um-scale
 
conference presentation

Tying top down to bottom up: Nano-engineering between bolecular and um-scale

Brugger, J  
•
Kim, G M  
•
Kim, B J
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2002
Seiken Symposium on Micro/Nano Mechatronics

not available

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Type
conference presentation
Author(s)
Brugger, J  
Kim, G M  
Kim, B J
Holleman, J
Huskens, J
ten Have, E
Kovalgin, A
Liebau, M
Reinhoudt, D N
van Hulst, H F
Date Issued

2002

Written at

EPFL

EPFL units
LMIS1  
Event nameEvent placeEvent date
Seiken Symposium on Micro/Nano Mechatronics

Tokyo, Japan

25-26 March, 2002

Available on Infoscience
March 2, 2007
Use this identifier to reference this record
https://infoscience.epfl.ch/handle/20.500.14299/3363
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